We recognise the importance of R&D and therefore place a strong emphasis on continuous improvement in process capabilities, product development and technological advancement.
New Development - Product
-
6-8 layers FPC with blind and buried microvias
-
6-10 layers Rigid Flex with blind buried microvias
-
Embedded passive and active packages
New Developments - Materials
-
Full LCP Stackup
-
Photoimageable Coverlay
New Development - Processes
-
0.060 mm pitch HDI
-
0.050mm microvia
-
Via fill interconnect
-
ENEPIG
New Development - Assembly
-
01005 assembly package
-
BTB connector pitch 0.35mm
