MATERIALS
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Substrate -
Polyimide (Kapton, Kaneka, Upilex), Polyester (PEN & PET), LCP, Rigid (FR4, CEM, Teflon) -
Cover -
Polyimide (Kapton, Kaneka), Polyester (PEN & PET), Flexible LPI Soldermask -
Adhesive -
Acrylic, Fire Retardant Acrylic, Modified Epoxy, Butyral Phenolic, Polyester, Adhesiveless
STIFFENER
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Polyimide (Kapton, Upilex), Polyester, Epoxy (FR4, G10, CEM), Aluminum, Stainless Steel, Plastics
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Attached with Pressure Sensitive Adhesive or Thermoset Adhesive.
EMI SHIELDING
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Silver Epoxy Coating, Silver Foil Lamination, Copper Foil Lamination
Multilayer Flex Construction
Rigid Flex Construction
Drilling
Lamination
Imaging
Etching & Stripping
Plating
Electrical Testing
We have been investing in the latest equipment to automate our manufacturing processes to meet higher standards in products reliability and excellent consistency in quality.
| Feature - FPC | Capability |
|---|---|
| Minimum line width and space - conventional | 0.075mm / 0.075mm (3/3 mils) |
| Minimum line width and space - HDI | 0.04mm and 0.04mm (1.6/1.6 mils) |
| Minimum drill hole size - conventional | 0.20mm (8 mils) |
| Minimum drill hole size - microvia | 0.05mm (2 mils) |
| Minimum drilled PTH Annular Ring - conventional | 0.125mm (5 mils) |
| Minimum drilled PTH Annular Ring - microvia | 0.075mm (3 mils) |
| Minimum punch hole size | 0.50mm (20 mils) |
| Minimum distance from hole edge to board edge | 0.50mm (20 mils) |
| Minimum distance between punched coverfilm openings | 0.30mm (12 mils) |
| Minimum tolerance from board edge to ZIF finger | 0.075mm (3mils) |
| Feature - Assembly | Capability |
|---|---|
| Passive component package | 0201 package |
| QFP, BGA, uBGA | 0.5mm pitch |
| BTB connector pitch | 0.40 mm |
| Eutectic Flip Chip package with underfill | |
| Heater FPC Lamination | |
| Metal Heat Sink / stiffener Lamination | |
| Keypad Mylar Dome Attachment | |
| Integration of plastics to flex | |
| Plating and Finishing |
|---|
| Acid Copper |
| Electrolytic Tin/Copper |
| Electrolytic Nickeless Soft Gold |
| Electrolytic Hard Gold |
| Electrolytic Bondable Soft Gold |
| Electroless Nickel, Immersion Gold |
| Solder paste print and reflow |
| Organic Solder Protection |